Wednesday  |  Conference Center B  |  02:30 PM–02:50 PM

#13483, Creep Characterization of amorphous silica in the TEM Using In-situ Imaging Methods and Finite Element Analysis

Glass and ceramic materials generally exhibit limited creep behavior in bulk experiments at room temperature. However, their creep response can be significant under electron irradiation, thus making creep modelling in such environment necessary. In this work, in-situ bending experiments are performed in the Transmission Electron Microscope (TEM) on amorphous silica and crystalline spinel microbeam samples milled by focused ion beam. To measure full-field deformation, gold nanoparticles are deposited on the surface of the silica microbeam samples, and serve as either a speckle pattern for digital image correlation (DIC) or target particles for particle tracking (PT). 2D finite element analyses (FEA) are conducted using Norton’s Law for creep and an inverse approach is employed to derive creep properties. The corresponding FEA full-field displacement results are then compared with the in-situ experimental measurements of DIC and PT as a validation of the model. Following similar procedures, creep behavior for MgAl2O4 spinel is also evaluated as a demonstration of creep analysis for crystalline materials.

Yiguang Zhang   University of Illinois at Urbana-Champaign
Shen Dillon   University of California Irvine
John Lambros   University of Illinois at Urbana-Champaign