Thursday | Conference Center A | 02:10 PM–02:30 PM
#13618, Novel Experimental Technique for Calibration of Cohesive Parameters
The adhesion strength of binder and explosive crystals in polymer-bonded energetic materials dictates the resulting mechanical properties of these materials under different loading conditions. In the current work, a miniaturized experimental setup capable of performing a peel test at different peel rates (10 nm/s-1 mm/s) and at constant peel angles (45º-135º) has been developed to experimentally quantify interfacial adhesion between soft elastomer and hard substrates. The peel tests were performed for various combinations of mock simulant (sugar) and binders (PDMS/ graphene reinforced PDMS) interfaces, and the adhesion energy was quantified. To aid the accurate calibration of the cohesive parameters for the crystal-binder interface, a novel experimental protocol in conjunction with a modified Mori-Tanaka model was developed. This novel experimental procedure involved the use of a soft lithography-based fabrication process to fabricate granular composites with a highly controllable 2D columnar model microstructure that allows for semi-analytical modeling of interfacial failure. This technique allows for the control of different aspects of the microstructure for a particular binder-crystal system such as size, morphology, and arrangement of crystals. The quasi-static mechanical response of these model granular composites was quantified using a custom-built micro-tensile experimental setup. Digital Image Correlation (DIC) was employed to measure the full-field kinematic and strain fields. The quasi-static tensile data for these 2D columnar granular composite specimens facilitated the calibration of the cohesive parameters for the crystal-binder interfaces.
Meena Kodali Worcester Polytechnic Institute
Prajwal Bharadwaj Worcester Polytechnic Institute
Nikhil Karanjgaokar Worcester Polytechnic Institute
Novel Experimental Technique for Calibration of Cohesive Parameters
Category
23rd International Symposium on Micro- and Nanomechanics (ISMAN)