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#15952, Thermoelastic Stress Analysis at Crack Tip Using Visible-infrared Synchronous Measurement
Thermoelastic stress analysis by infrared thermography was performed to evaluate fracture mechanics of cracks. The position correction using the synchronous measurement of the visible camera was performed to improve the accuracy of the thermoelastic stress analysis. The stress intensity factor was calculated from the thermoelastic stress measurement, the measured stress intensity factor range was in good agreement with the effective stress intensity factor range. The displacement and strain around the crack were measured from digital image correlation DIC with a visible camera. Comparing the thermoelastic temperature change and crack closure behavior, it was found that the crack closure behavior corresponds to the generation of harmonics component of temperature change. The phase analysis of thermoelastic temperature change revealed the possibility of extracting temperature change due to crack closure and temperature change due to energy dissipation caused by plastic deformation separately. It was also clarified that the crack tip can be accurately identified from the distribution of harmonic components of temperature change.
Daiki Shiozawa Kobe University
Hiroki Yamamoto Kobe University
Yuki Ogawa Kobe University
Takahide Sakagami Kobe University
Thermoelastic Stress Analysis at Crack Tip Using Visible-infrared Synchronous Measurement